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| 1. P-type Silicon
Wafer |
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2. Texturization |
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3. Phosphorus
Diffusion |
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| 4. Edge Isolation + Glass Removal |
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5. Anti-Reflection Coating |
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6. Electrode Printing |
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| 7. Firing and Contact Forming |
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8. Testing and Classification |
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テクスチャー |
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リンドーピング拡散, PN接合形成 |
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エッジ処理 + PSG除去 |
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反射防止膜形成（PECVD） |
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スクリーン印刷 |
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焼成 |
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外観及び特性検査と選別 |
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